The Dimensity 9200+ is produced using TSMC’s second generation 4nm manufacturing process (N4P), so the MFP and GPU cores can “work” at faster speeds.
The company promises an increase in CPU performance by 10% (the processor has two Cortex-X3 cores with an operating frequency of 3.35 GHz, three Cortex-A715 cores at 3.0 GHz and four Cortex-A510 cores at 2.0 GHz) compared to the first version of the SoC and an increase of 17% in performance. Graphics performance is average with the company not giving more information about ARM’s idle G715 GPU.
FHD + displays with a refresh rate of up to 240 Hz, QHD + supports up to 144 Hz and two 2.5K displays with a frequency of 60 Hz. Below you can see a comparison table with the new Dimensity 9200+ features.
MediaTek claims that the new SoC shows excellent energy efficiency with the Dimensity 9200+ saving 10-21% of power in several popular games, 35% in using various messaging applications and 36% in WiFi hotspot mode. We do not currently know which smartphones will be launched with Dimensity 9200+ inside but we are sure that we will see the first devices within the quarter.
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