The Dimensity 9200+ is produced using TSMC’s second generation 4nm manufacturing process (N4P), so the MFP and GPU cores can “work” at faster speeds.
The company promises an increase in CPU performance by 10% (the processor has two Cortex-X3 cores with an operating frequency of 3.35 GHz, three Cortex-A715 cores at 3.0 GHz and four Cortex-A510 cores at 2.0 GHz) compared to the first version of the SoC and an increase of 17% in performance. Graphics performance is average with the company not giving more information about ARM’s idle G715 GPU.
FHD + displays with a refresh rate of up to 240 Hz, QHD + supports up to 144 Hz and two 2.5K displays with a frequency of 60 Hz. Below you can see a comparison table with the new Dimensity 9200+ features.
MediaTek claims that the new SoC shows excellent energy efficiency with the Dimensity 9200+ saving 10-21% of power in several popular games, 35% in using various messaging applications and 36% in WiFi hotspot mode. We do not currently know which smartphones will be launched with Dimensity 9200+ inside but we are sure that we will see the first devices within the quarter.
-
8
-
2
“Total alcohol fanatic. Coffee junkie. Amateur twitter evangelist. Wannabe zombie enthusiast.”
More Stories
Is this what the PS5 Pro will look like? (Image)
Finally, Windows 11 24H2 update significantly boosts AMD Ryzen – Windows 11 performance
Heart Surgeon Reveals The 4 Things He ‘Totally Avoids’ In His Life